Apple’s future chip developments have surfaced through recent leaks, revealing plans for the M6 and M7 processors, as well as a powerful AI server chip.
M6 and M7: The Next Steps in Apple Silicon
The M6 chip, codenamed “Komodo,” is expected to debut in 2026, followed by the M7, known internally as “Borneo,” in 2027. These chips aim to enhance performance and efficiency in upcoming Mac devices. The M6 is anticipated to utilize TSMC’s 2nm process technology, marking a significant advancement in Apple’s chip manufacturing.
Project Baltra: Apple’s AI Server Chip
In addition to consumer-focused chips, Apple is reportedly developing a high-performance AI server chip under the codename “Baltra.” This processor is designed to handle intensive AI workloads and is expected to feature configurations with up to eight times the CPU and GPU cores of the current M3 Ultra. The Baltra chip is projected to be completed by 2027.
Expanding into Wearables
Apple is also working on specialized chips for future wearable devices, including smart glasses, AirPods, and Apple Watch models equipped with cameras. These chips aim to provide efficient processing for devices with multiple cameras and are expected to enter mass production by late 2026 or 2027.
These developments indicate Apple’s commitment to advancing its hardware capabilities across various product lines, focusing on performance, efficiency, and integration of AI technologies.
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